TO-22-A004 – Performance Approaches for Improving Airflow Parallelism in a Semiconductor Cleanroom

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Semiconductors are manufactured in cleanrooms with very high standards of cleanliness to minimize contamination problems, even submicron size particles can lead to a total failure of a complete production process. Contamination control is a key factor in assuring product reliability. To show the actual airflow pattern throughout the unidirectional flow cleanroom and to demonstrate the effects on airflow caused by equipment, the cleanroom needs to meet the design standard of airflow parallelism. However, controlling the airflow parallelism inside the room poses a big challenge in the cleanroom design and operation. Computational Fluid Dynamics (CFD) simulation is applied to investigate extensively on the airflow parallelism and contamination concentration to find better approaches to achieve a better design in cleanroom. The strategy that proposed in this simulation is to change the supply air velocity profile, height of raised floor, perforated floor porosity type which will affect the parallelism of airflow distribution inside the cleanroom. The velocity of supply air was conducted at 0.3 m/s, 0.4 m/s, and 0.5 m/s. While the height of raised floor was 0.6 m, 0.8 m, and 1 m respectively. The perforated floor porosity type used are round and square. The results revealed that the deflection angle of parallelism will increases along with the supply air velocity profile, and will decreases along with the height of raised floor, and perforated floor porosity of round type presents a lower deflection of angle than square type. 

Product Details

Published:

2022

Number of Pages:

3

Units of Measure:

Dual

File Size:

1 file , 4.7 MB

Product Code(s):

D-TO-22-A004

Note:

This product is unavailable in Russia, Belarus