JEDEC JS 9702

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This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.

Product Details

Published:
06/01/2004
Number of Pages:
19
File Size:
1 file , 230 KB

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