JEDEC JESD22-B117B

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The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

Product Details

Published:
05/01/2014
Number of Pages:
22
File Size:
1 file , 310 KB
Redline File Size:
2 files , 4 MB

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