JEDEC JESD22-B116B

Click here to purchase
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.

Product Details

Published:
04/01/2017
Number of Pages:
32
File Size:
1 file , 1.8 MB

Related Posts