JEDEC JESD22-B110B

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Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of components and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test components in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for component qualification. This document also replaces JESD22-B104.

Product Details

Published:
07/01/2013
Number of Pages:
14
File Size:
1 file , 150 KB

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