IPC J-STD-005
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Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material’s performance in the manufacturing process). Supersedes QQ-S-571.
Product Details
- Published:
- 01/01/1995
- ANSI:
- ANSI Approved
- Number of Pages:
- 38
- File Size:
- 1 file , 320 KB
- Part of:
- IPC A-20/21-GKIT
- Product Code(s):
- J-005(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
