IPC J-STD-005

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Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material’s performance in the manufacturing process). Supersedes QQ-S-571.

Product Details

Published:
01/01/1995
ANSI:
ANSI Approved
Number of Pages:
38
File Size:
1 file , 320 KB
Part of:
IPC A-20/21-GKIT
Product Code(s):
J-005(D)1
Note:
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