IEC 61192-4 Ed. 1.0 b:2002
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- IEC
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Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Product Details
- Edition:
- 1.0
- Published:
- 11/29/2002
- Number of Pages:
- 59
- File Size:
- 1 file , 3.5 MB
