
IEC 61190-1-2 Ed. 1.0 b:2002
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- IEC
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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Product Details
- Edition:
- 1.0
- Published:
- 03/22/2002
- Number of Pages:
- 35
- File Size:
- 1 file , 1.3 MB