IEC 61190-1-2 Ed. 1.0 b:2002

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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Product Details

Edition:
1.0
Published:
03/22/2002
Number of Pages:
35
File Size:
1 file , 1.3 MB