IEC 61190-1-2 Ed. 1.0 b:2002

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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Product Details

Edition:

1.0

Published:

03/22/2002

Number of Pages:

35

File Size:

1 file , 1.3 MB