IEC 61188-5-4 Ed. 1.0 en:2007

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Provides the component and land pattern dimensions for small outline integrated circuits with “J” leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Product Details

Edition:

1.0

Published:

10/30/2007

Number of Pages:

15

File Size:

1 file , 840 KB