IEC 60749-30 Ed. 1.0 b:2005

Click here to purchase
Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Product Details

Edition:
1.0
Published:
01/20/2005
Number of Pages:
27
File Size:
1 file , 380 KB