
IEC 60512-6-2 Ed. 1.0 b:2002
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- IEC
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Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
Product Details
- Edition:
- 1.0
- Published:
- 02/21/2002
- Number of Pages:
- 9
- File Size:
- 1 file , 400 KB