ASTM F615M-95(2013)

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1.1 This practice covers procedures for determining operating regions that are safe from metallization burnout induced by current pulses of less than 1-s duration.

Note 1–In this practice, “metallization” refers to metallic layers on semiconductor components such as interconnect patterns on integrated circuits. The principles of the practice may, however, be extended to nearly any current-carrying path. The term “burnout” refers to either fusing or vaporization.

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Published:
05/01/2013
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