JEDEC JESD217.01
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
standard by JEDEC Solid State Technology Association, 10/01/2016
- Comments Off on JEDEC JESD217.01
- JEDEC
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
standard by JEDEC Solid State Technology Association, 10/01/2016
System Level ESD Part II: Implementation of Effective ESD Robust Designs
standard by JEDEC Solid State Technology Association, 09/01/2019
NAND Flash Interface Interopability
standard by JEDEC Solid State Technology Association, 06/01/2019
Universal Flash Storage Host Controller Interface (UFSHCI), Unified Memory Extension
standard by JEDEC Solid State Technology Association, 03/01/2016
Addendum No. 1 to JESD209-4 – Low Power Double Data Rate 4 (LPDDR4)
Amendment by JEDEC Solid State Technology Association, 01/01/2017
Byte Addressable Energy Backed Interface
standard by JEDEC Solid State Technology Association, 09/01/2017
DEFINITION OF THE SSTUA32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY TEST FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
HSUL_12 LPDDR2 and LPDDR3 I/O with Optional ODT
standard by JEDEC Solid State Technology Association, 04/01/2014
MEASUREMENT OF SMALL VALUES OF TRANSISTOR CAPACITANCE
standard by JEDEC Solid State Technology Association, 07/01/1972
DIGITAL BIPOLAR LOGIC PINOUTS FOR CHIP CARRIERS
standard by JEDEC Solid State Technology Association, 12/01/1982