JEDEC JEP139
GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 12/01/2000
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GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 12/01/2000
Universal Flash Storage (UFS) Test
standard by JEDEC Solid State Technology Association, 03/01/2013
Mechanical Shock – Component and Subassembly
standard by JEDEC Solid State Technology Association, 07/01/2013
RECOMMENDED ESD-CDM TARGET LEVELS
standard by JEDEC Solid State Technology Association, 10/01/2009
POD18 – 1.8 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 12/01/2006
WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 08/01/2009
RECOMMENDED ESD TARGET LEVELS FOR HBM QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2018
Mark Legibility
standard by JEDEC Solid State Technology Association, 05/01/2011
SCALABLE LOW-VOLTAGE SIGNALING FOR 400 MV (SLVS-400)
standard by JEDEC Solid State Technology Association, 10/01/2001
STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES WITH 3.6 V CMOS TOLERANT INPUTS AND OUTPUTS
standard by JEDEC Solid State Technology Association, 10/01/2000