JEDEC JS 9702
IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
standard by JEDEC Solid State Technology Association, 06/01/2004
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IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
standard by JEDEC Solid State Technology Association, 06/01/2004
MEASUREMENT OF SMALL SIGNAL HF, VHF, AND UHF POWER GAIN OF TRANSISTORS
standard by JEDEC Solid State Technology Association, 05/01/1965
Addendum No. 1 to JESD209A – LOW POWER DOUBLE DATA RATE (LPDDR) SDRAM, 1.2 V I/O
standard by JEDEC Solid State Technology Association, 03/01/2009
ADDENDUM No. 4 to JESD8 – CENTER-TAP-TERMINATED (CTT) INTERFACE LOW-LEVEL, HIGH-SPEED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 11/01/1993
Byte Addressable Energy Backed Interface
standard by JEDEC Solid State Technology Association, 09/01/2019
TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 01/01/2008
Inspection Criteria for Microelectronic Packages and Covers
standard by JEDEC Solid State Technology Association, 05/01/2011
DESCRIPTION OF 5 V BUS SWITCH WITH TTL-COMPATIBLE CONTROL INPUTS
standard by JEDEC Solid State Technology Association, 06/01/1999
MEASUREMENT OF TRANSISTOR NOISE FIGURE AT MF, HF, AND VHF
standard by JEDEC Solid State Technology Association, 11/01/1981
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
standard by JEDEC Solid State Technology Association, 01/01/2008