JEDEC JESD51-8
INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – JUNCTION-TO-BOARD
standard by JEDEC Solid State Technology Association, 10/01/1999
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INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – JUNCTION-TO-BOARD
standard by JEDEC Solid State Technology Association, 10/01/1999
STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE
standard by JEDEC Solid State Technology Association, 02/01/1998
GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/1998
METHOD FOR DEVELOPING ACCELERATION MODELS FOR ELECTRONIC COMPONENT FAILURE MECHANISMS
standard by JEDEC Solid State Technology Association, 08/01/2003
A PROCEDURE FOR MEASURING P-CHANNEL MOSFET HOT-CARRIER-INDUCED DEGRADATION AT MAXIMUM GATE CURRENT UNDER DC STRESS
standard by JEDEC Solid State Technology Association, 09/01/2004
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2010
STANDARD METHOD FOR MEASURING AND USING THE TEMPERATURE COEFFICIENT OF RESISTANCE TO DETERMINE THE TEMPERATURE OF A METALLIZATION LINE
standard by JEDEC Solid State Technology Association, 02/01/2004
ADDENDUM No. 11 to JESD24 – POWER MOSFET EQUIVALENT SERIES GATE RESISTANCE TEST METHOD
Amendment by JEDEC Solid State Technology Association, 08/01/1996
TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR MICROELECTRONIC DEVICES
standard by JEDEC Solid State Technology Association, 05/01/2007
TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS
standard by JEDEC Solid State Technology Association, 06/01/2001