JEDEC JESD51-10
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
standard by JEDEC Solid State Technology Association, 07/01/2000
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TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
standard by JEDEC Solid State Technology Association, 07/01/2000
FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2009
ADDENDUM No. 5 to JESD8 – 2.5 V 0.2 V (NORMAL RANGE), AND 1.8 V TO 2.7 V (WIDE RANGE) POWER SUPPLY VOLTAGE AND INTERFACE STANDARD FOR NONTERMINATED DIGITAL INTEGRATED CIRCUIT
standard by JEDEC Solid State Technology Association, 09/01/2007
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2008
HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
standard by JEDEC Solid State Technology Association, 01/01/2009
FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 10/01/2011
DESCRIPTION OF 1.8 V CMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 04/01/2000
SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD
standard by JEDEC Solid State Technology Association, 09/01/2010
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
standard by JEDEC Solid State Technology Association, 10/01/2006
PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
standard by JEDEC Solid State Technology Association, 07/01/2015