JEDEC JESD73-3
STANDARD FOR DESCRIPTION OF 3867 – 2.5 V, SINGLE 10-BIT, 2-PORT, DDR FET SWITCH
standard by JEDEC Solid State Technology Association, 11/01/2001
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STANDARD FOR DESCRIPTION OF 3867 – 2.5 V, SINGLE 10-BIT, 2-PORT, DDR FET SWITCH
standard by JEDEC Solid State Technology Association, 11/01/2001
SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 07/01/2016
CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 10/01/2007
ADDENDUM No. 10 to JESD24 – TEST METHOD FOR MEASUREMENT OF REVERSE RECOVERY TIME trr FOR POWER MOSFET DRAIN-SOURCE DIODES
Amendment by JEDEC Solid State Technology Association, 08/01/1994
JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/1999
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 03/01/2006
Universal Flash Storage (UFS) Test
standard by JEDEC Solid State Technology Association, 07/01/2017
DEFINITION OF THE SSTV16857 2.5 V, 14-BIT SSTL_2 REGISTERED BUFFER FOR DDR DIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 11/01/2004
PHYSICAL DIMENSION
standard by JEDEC Solid State Technology Association, 06/01/2003
Thermal Test Chip Guideline (Wire Bond Type Chip)
standard by JEDEC Solid State Technology Association, 06/01/2019