JEDEC JESD51-4A

Thermal Test Chip Guideline (Wire Bond Type Chip)
standard by JEDEC Solid State Technology Association, 06/01/2019

JEDEC JESD49A (R2009)

PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)
standard by JEDEC Solid State Technology Association, 09/01/2005

JEDEC JESD22-A102C (R2008)

ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 12/01/2000

JEDEC JESD8-33

.05 Low Voltage Swing Terminated Logic (LVSTL05)
standard by JEDEC Solid State Technology Association, 06/01/2019

JEDEC JESD 12-4

ADDENDUM No. 4 to JESD12 – METHOD OF SPECIFICATION OF PERFORMANCE PARAMETERS FOR CMOS SEMICUSTOM INTEGRATED CIRCUITS
Amendment by JEDEC Solid State Technology Association, 04/01/1987

JEDEC JEP131A

PROCESS FAILURE MODE AND EFFECTS ANALYSIS (FMEA)
standard by JEDEC Solid State Technology Association, 05/01/2005

JEDEC JESD73-3

STANDARD FOR DESCRIPTION OF 3867 – 2.5 V, SINGLE 10-BIT, 2-PORT, DDR FET SWITCH
standard by JEDEC Solid State Technology Association, 11/01/2001

JEDEC JESD22-B115A.01

SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 07/01/2016

JEDEC JESD22-A100C

CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 10/01/2007