JEDEC JS 9704
IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
standard by JEDEC Solid State Technology Association, 06/01/2005
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IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
standard by JEDEC Solid State Technology Association, 06/01/2005
POD135 – 1.35 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 06/01/2019
MECHANICAL COMPRESSIVE STATIC STRESS TEST METHODS
standard by JEDEC Solid State Technology Association, 10/01/2018
Addendum No. 1 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 01/01/2013
Byte Addressable Energy Backed Interface
standard by JEDEC Solid State Technology Association, 07/01/2017
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 12/01/2016
REFERENCE GUIDE TO LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 05/01/2003
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)
standard by JEDEC Solid State Technology Association, 04/01/1995
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
standard by JEDEC Solid State Technology Association, 11/01/2010
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
standard by JEDEC Solid State Technology Association, 11/01/2012