JEDEC JEP156

CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
standard by JEDEC Solid State Technology Association, 03/01/2009

JEDEC JESD51-14

INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
standard by JEDEC Solid State Technology Association, 11/01/2010

JEDEC JEP153A

CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014

JEDEC JESD625B

REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES
standard by JEDEC Solid State Technology Association, 01/01/2012

JEDEC JESD79-3-1A

Addendum No. 1 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 01/01/2013

JEDEC JESD245B

Byte Addressable Energy Backed Interface
standard by JEDEC Solid State Technology Association, 07/01/2017

JEDEC JESD22-A108E

TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 12/01/2016

JEDEC JEP104C.01

REFERENCE GUIDE TO LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 05/01/2003

JEDEC JESD16-A (R2008)

ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)
standard by JEDEC Solid State Technology Association, 04/01/1995