EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2018
Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)
standard by JEDEC Solid State Technology Association, 04/18/2012
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 07/01/2015
LOW FREQUENCY POWER TRANSISTORS
standard by JEDEC Solid State Technology Association, 01/01/1976
MULTIMEDIACARD (MMC) MECHANICAL STANDARD
standard by JEDEC Solid State Technology Association, 12/01/2007
ACCELERATED MOISTURE RESISTANCE – UNBIASED HAST
standard by JEDEC Solid State Technology Association, 03/01/2011
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
standard by JEDEC Solid State Technology Association, 03/01/2009
INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
standard by JEDEC Solid State Technology Association, 11/01/2010
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014
IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
standard by JEDEC Solid State Technology Association, 06/01/2005
