JEDEC JEP176
ADAPTER TEST BOARD RELIABILITY TEST GUIDELINES
standard by JEDEC Solid State Technology Association, 01/01/2018
- Comments Off on JEDEC JEP176
- JEDEC
ADAPTER TEST BOARD RELIABILITY TEST GUIDELINES
standard by JEDEC Solid State Technology Association, 01/01/2018
CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 08/01/2017
ADDENDUM No. 4 to JESD24 – THERMAL IMPEDANCE MEASUREMENTS FOR BIPOLAR TRANSISTORS (DELTA BASE-EMITTER VOLTAGE METHOD)
Amendment by JEDEC Solid State Technology Association, 11/01/1990
MEASUREMENT OF REVERSE RECOVERY TIME FOR SEMICONDUCTOR SIGNAL DIODES
standard by JEDEC Solid State Technology Association, 07/01/1996
DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
LIFE TEST METHODS FOR PHOTOCONDUCTIVE CELLS
standard by JEDEC Solid State Technology Association, 09/01/1969
FBDIMM STANDARD: DDR2 SDRAM FULLY BUFFERED DIMM (FBDIMM) DESIGN SPECIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2007
PROCEDURE FOR MEASURING INPUT CAPACITANCE USING A VECTOR NETWORK ANALYZER (VNA)
standard by JEDEC Solid State Technology Association, 10/01/2003
Potential Failure Mode and Effects Analysis (FMEA)
standard by JEDEC Solid State Technology Association, 08/01/2018
GUIDELINE FOR ASSESSING THE CURRENT-CARRYING CAPABILITY OF THE LEADS IN A POWER PACKAGE SYSTEM
standard by JEDEC Solid State Technology Association, 02/01/2003