DEFINITION OF EXTERNAL CLEARANCE AND CREEPAGE DISTANCES OF DISCRETE SEMICONDUCTOR PACKAGES FOR THYRISTORS AND RECTIFIER DIODES
standard by JEDEC Solid State Technology Association, 11/01/1983
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1993
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 11/01/2010
DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 11/01/2004
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
standard by JEDEC Solid State Technology Association, 04/01/2018
SEMICONDUCTOR POWER CONTROL MODULES
standard by JEDEC Solid State Technology Association, 11/01/1986
GDDR5 SGRAM
standard by JEDEC Solid State Technology Association, 09/01/2009
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2018
Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)
standard by JEDEC Solid State Technology Association, 04/18/2012
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 07/01/2015
