JEDEC JEP163
SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS
standard by JEDEC Solid State Technology Association, 09/01/2015
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SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS
standard by JEDEC Solid State Technology Association, 09/01/2015
DEFINITION OF EXTERNAL CLEARANCE AND CREEPAGE DISTANCES OF DISCRETE SEMICONDUCTOR PACKAGES FOR THYRISTORS AND RECTIFIER DIODES
standard by JEDEC Solid State Technology Association, 11/01/1983
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1993
Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)
standard by JEDEC Solid State Technology Association, 04/18/2012
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 07/01/2015
LOW FREQUENCY POWER TRANSISTORS
standard by JEDEC Solid State Technology Association, 01/01/1976
RECOMMENDED CHARACTERIZATION OF MOS SHIFT REGISTERS
standard by JEDEC Solid State Technology Association, 11/01/1972
Universal Flash Storage (UFS)
standard by JEDEC Solid State Technology Association, 03/01/2016
ELECTRICAL PARAMETERS ASSESSMENT
standard by JEDEC Solid State Technology Association, 10/01/2009
DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 11/01/2004