JEDEC JESD51
METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995
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METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995
JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2008
STANDARD FOR DESCRIPTION OF A 3.3 V, 18-BIT, LVTTL I/O REGISTER FOR PC133 REGISTERED DIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 07/01/2001
SOLDER BALL SHEAR
standard by JEDEC Solid State Technology Association, 05/01/2014
PRODUCT DISCONTINUANCE
standard by JEDEC Solid State Technology Association, 12/01/2011
UNDERSTANDING ELECTRICAL OVERSTRESS – EOS
standard by JEDEC Solid State Technology Association, 09/01/2016
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 09/01/2012
SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES
standard by JEDEC Solid State Technology Association, 07/01/2012
Universal Flash Storage (UFS)
standard by JEDEC Solid State Technology Association, 06/01/2012
STUB SERIES TERMINATED LOGIC FOR 1.8 V (SSTL_18)
standard by JEDEC Solid State Technology Association, 09/01/2003