11/09/202015/08/2019

IPC JP002

JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006

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11/09/202015/08/2019

IPC FLEX-CO-99

IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999

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11/09/202015/08/2019

IPC SM-784

Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990

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11/09/202015/08/2019

IPC WP-006

Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003

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11/09/202015/08/2019

IPC PD-335

Electronic Packaging Handbook
standard by Association Connecting Electronics Industries, 01/01/1989

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11/09/202015/08/2019

IPC J-STD-609

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 05/01/2007

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11/09/202015/08/2019

IPC TR 585

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006

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