IPC A-610F-WAM1

Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016

IPC JP002

JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006

IPC FLEX-CO-99

IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999

IPC J-STD-609

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 05/01/2007

IPC WP-006

Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003

IPC PD-335

Electronic Packaging Handbook
standard by Association Connecting Electronics Industries, 01/01/1989

IPC TR 585

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006