IPC SM-784

Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990

IPC MC-790

Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992

IPC HDBK-850

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012

IPC PD-335

Electronic Packaging Handbook
standard by Association Connecting Electronics Industries, 01/01/1989

IPC J-STD-609

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 05/01/2007

IPC WP-006

Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003

IPC TR 585

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006