IPC SM-784
Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990
- Comments Off on IPC SM-784
- IPC
Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990
Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012
Electronic Packaging Handbook
standard by Association Connecting Electronics Industries, 01/01/1989
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 05/01/2007
Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006