IPC J-STD-003C

Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2013

IPC FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid, or Rigid-Flex Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2014

IPC 9702-WAM1

Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2015

IPC HDBK-830A

Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013

IPC TR-468

Factors Affecting Insulation Resistance Performance of Printed Boards
standard by Association Connecting Electronics Industries, 03/01/1979

IPC D-390A

Automated Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/1988

IPC D-352

Electronic Design Data Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 08/01/1985

IPC A-610F-WAM1

Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016

IPC JP002

JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006

IPC FLEX-CO-99

IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999