IPC SM-840E

Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials
standard by Association Connecting Electronics Industries, 12/01/2010

IPC A-620

Requirements & Acceptance for Cable & Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 01/01/2002

IPC 7711/7721

Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/1998

IPC J-STD-003C

Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2013

IPC FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid, or Rigid-Flex Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2014

IPC 9702-WAM1

Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2015

IPC MC-790

Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992

IPC HDBK-850

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012

IPC D-352

Electronic Design Data Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 08/01/1985

IPC A-610F-WAM1

Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016