IPC A-610FC-Telecom(D)1
Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017
- Comments Off on IPC A-610FC-Telecom(D)1
- IPC
Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017
General Requirements for Dielectric Surface Mounting Adhesives
standard by Association Connecting Electronics Industries, 11/01/1989
Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987
IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")
standard by Association Connecting Electronics Industries, 08/01/2007
Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987
Guidance for the Development and Implementation of a White Plague Control Plan (WPCP)
standard by Association Connecting Electronics Industries, 12/01/2015