IPC CI-408
Solderless Surface Mount Connectors Design Characteristics and Application Guidelines
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994
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Solderless Surface Mount Connectors Design Characteristics and Application Guidelines
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994
Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001
Analysis of the Market for Rigid Printed Wiring Boards and Related Materials for 1999
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017
General Requirements for Dielectric Surface Mounting Adhesives
standard by Association Connecting Electronics Industries, 11/01/1989
Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987