IPC TR-465-2

The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993

IPC J-STD-004B

Requirements for Soldering Fluxes – includes Amendment 1
standard by Association Connecting Electronics Industries, 12/01/2008

IPC J-STD-003C-WAM1&2

Solderability Tests for Printed Boards with Amendment 1&2
standard by Association Connecting Electronics Industries, 09/01/2017

IPC 4101A

Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
standard by Association Connecting Electronics Industries, 06/01/2002

IPC 2252

Design Guide for RF/Microwave Circuit Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2002

IPC HERMES-9852

The Global Standard for Machine-to-Machine Communication in SMT Assembly
standard by Association Connecting Electronics Industries, 06/01/2019

IPC 2223D

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016

IPC J-STD-028

Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999

IPC 4821

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2006

IPC 1791A

Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 01/01/2020