IPC J-STD-028
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999
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IPC HERMES-9852
The Global Standard for Machine-to-Machine Communication in SMT Assembly
standard by Association Connecting Electronics Industries, 06/01/2019
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IPC A-22-G
UL Recognition Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
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IPC SM-840C Amendment 1
Qualification and Performance of Permanent Solder Mask- Amendment 1
Amendment by Association Connecting Electronics Industries, 06/01/2000
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