IPC 9631

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

IPC 6013D

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

IPC 9151D

Process Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Database
standard by Association Connecting Electronics Industries, 05/01/2012

IPC ML-960

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/1994

IPC 2251

Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003

IPC J-STD-075

Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries, 08/01/2008

IPC T-50K

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013

IPC A-620AS

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies
Amendment by Association Connecting Electronics Industries, 06/01/2012

IPC 4562

Metal Foil for Printed Wiring Applications, Includes Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2000

IPC TMRC99F

TMRC 1999 Market for Flexible Circuits
Report / Survey by Association Connecting Electronics Industries, 06/27/2000