IPC DW-424

General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995

IPC 9592

Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
standard by Association Connecting Electronics Industries, 09/01/2008

IPC 4204B

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018

IPC 4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2008

IPC WP-1081

White Paper on Conflict Minerals Due Diligence Guidance
standard by Association Connecting Electronics Industries, 07/01/2015

IPC J-STD-033D

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
standard by Association Connecting Electronics Industries, 03/01/2018

IPC TR-470

Thermal Characteristics of Multilayer Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1974

IPC J-STD-013

Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996

IPC CH-65A

Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999

IPC 2513A

Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description
standard by Association Connecting Electronics Industries, 11/01/2000