IPC J-STD-006B

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 01/01/2006

IPC LDFR0603

IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

IPC L-108B

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990

IPC 4553A

Specification for Immersion Silver Plating for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2009

IPC A-600K

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/09/2020

IPC 9706

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013

IPC D-326A

Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2004

IPC 4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2008

IPC 9111

Troubleshooting for Printed Board Assembly Processes
standard by Association Connecting Electronics Industries, 01/01/2019

IPC J-STD-001G – Amendment

Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2018

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