IPC 6012D-AM1

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 09/01/2017

IPC 4412B – Amendment 2

Specification for Finished Fabric Woven from "E" Glass for Printed Boards – Amendment 2
Amendment by Association Connecting Electronics Industries, 05/01/2018

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IPC HDIS-98

HDIS 1998 Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1998

IPC 1756

Manufacturing Process Data Management
standard by Association Connecting Electronics Industries, 03/01/2010

IPC A-610GC-Telecom(D)1

Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2019

IPC 9707

Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011

IPC APEX-EXPO19

IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019

IPC 2226A

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

IPC 2225

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998

IPC 6018B

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011