IPC D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

IPC 9691B

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

IPC SA-61A

Post Solder Semiaqueous Cleaning Handbook
standard by Association Connecting Electronics Industries, 07/01/2002

IPC TMRC-00T

2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000

IPC HDBK-4691

Handbook on Adhesive Bonding in Electronic Assembly Operations
standard by Association Connecting Electronics Industries, 11/01/2015

IPC 9199

Statistical Process Control (SPC) Quality Rating
standard by Association Connecting Electronics Industries, 09/01/2002

IPC QE-605A

Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999

IPC 6013C

Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,

IPC 2222

Sectional Standard on Rigid PWB Design
standard by Association Connecting Electronics Industries, 03/01/1998

IPC 7530A

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
standard by Association Connecting Electronics Industries, 03/01/2017