IPC QE-605A

Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999

IPC 6013C

Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,

IPC 2222

Sectional Standard on Rigid PWB Design
standard by Association Connecting Electronics Industries, 03/01/1998

IPC 7530A

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
standard by Association Connecting Electronics Industries, 03/01/2017

IPC CA-821

General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995

IPC A-311

Process Controls for Phototool Generation and Use
standard by Association Connecting Electronics Industries, 03/01/1996

IPC 6012DS

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2015

IPC TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001

IPC D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

IPC 9691B

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016