IPC 6012A-AM

Qualification and Performance Specification for Rigid Printed Boards – Includes Amendment 1
standard by Association Connecting Electronics Industries, 10/01/1999

IPC 4103A-WAM1

Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014

IPC 7711/7721C

Rework, Modification and Repair of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2017

IPC 9201A

Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007

IPC J-STD-032

Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
standard by Association Connecting Electronics Industries, 06/01/2002

IPC 9708

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

IPC 7621

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

IPC CA-821

General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995

IPC A-311

Process Controls for Phototool Generation and Use
standard by Association Connecting Electronics Industries, 03/01/1996

IPC 6012DS

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2015