IPC 6013A

Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2005

IPC 6012C

Qualification and Performance Specification for Rigid Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010

IPC J-STD-001G

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017

IPC J-STD-032

Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
standard by Association Connecting Electronics Industries, 06/01/2002

IPC 9708

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

IPC 7621

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

IPC A-610F

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014

IPC 1791- Amendment 1

Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2019

IPC 2615

Printed Board Dimensions and Tolerances
standard by Association Connecting Electronics Industries, 07/01/2000

IPC A-630

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013