IPC J-STD-033B
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 10/01/2005
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Resin Coated Metal Foil for Printed Boards
Book by Association Connecting Electronics Industries, 09/01/1998
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IPC PERM-WP-022
White Paper on Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report
standard by Association Connecting Electronics Industries, 09/05/2018
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IPC DRM-18H
Component Identification Training and Reference Guide
standard by Association Connecting Electronics Industries, 12/01/2007
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IPC 9121 – Amendment 1
Troubleshooting for PCB Fabrication Processes – Amendment 1
Amendment by Association Connecting Electronics Industries, 04/01/2018
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IPC TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
standard by Association Connecting Electronics Industries, 09/01/1988
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