IPC DR-572

Drilling Guidelines for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/1988

IPC 6901

Application Categories for Printed Electronics
standard by Association Connecting Electronics Industries, 07/01/2015

IPC TR-484

Results of IPC Copper Foil Ductility Round Robin Study
standard by Association Connecting Electronics Industries, 04/01/1986

IPC MI-660

Guidelines for Incoming Inspection of Printed Board Material
standard by Association Connecting Electronics Industries,

IPC TR-483

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991

IPC SC-60A

Post Solder Solvent Cleaning Handbook
standard by Association Connecting Electronics Industries, 08/01/1999

IPC J-STD-002C

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)
standard by Association Connecting Electronics Industries, 12/01/2007

IPC 2611

Generic Requirements for Electronic Product Documentation
standard by Association Connecting Electronics Industries, 04/01/2010

IPC 4103A

Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 12/01/2011

IPC 4411

Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement
standard by Association Connecting Electronics Industries, 04/01/1999