IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline
standard by Association Connecting Electronics Industries, 11/01/2007

IPC 7095B

Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008

IPC 6017

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
standard by Association Connecting Electronics Industries, 03/01/2009

IPC 4101E-WAM1

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2020

IPC QE-615

Electronic Assembly Evaluation Handbook
standard by Association Connecting Electronics Industries,

IPC CC-830B with Amendment 1

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies – Includes Amendment 1
standard by Association Connecting Electronics Industries, 10/01/2008

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IPC 4553

Specification for Immersion Silver Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 06/01/2005

IPC A-610E

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010

IPC 4552-WAM1-2

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012

IPC 4411A

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
standard by Association Connecting Electronics Industries, 11/01/2003