IPC 4411-AM1

Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001

IPC J-STD-030A

Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014

IPC 8921

Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires
standard by Association Connecting Electronics Industries, 10/01/2019

IPC A-36

Cleaning Alternatives Artwork
standard by Association Connecting Electronics Industries,

IPC J-STD-001B

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/1995

IPC 6012DA

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 04/01/2016

IPC 9261A

In-Process DPMO and Estimated Yield for PCAs
standard by Association Connecting Electronics Industries, 10/01/2006

IPC J-STD-002B

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003

IPC 4104

Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999

IPC A-22-D

UL Recognition Test Pattern – Data – D-350
standard by Association Connecting Electronics Industries,