11/09/202015/08/2019

IPC 7092

Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015

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11/09/202015/08/2019

IPC 2315

Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000

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11/09/202015/08/2019

IPC 4552A

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2017

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11/09/202015/08/2019

IPC 1071B

Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 04/01/2016

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11/09/202015/08/2019

IPC 0040

Optoelectronics Assembly and Packaging Technology
standard by Association Connecting Electronics Industries, 05/01/2003

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11/09/202015/08/2019

IPC D-640

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
standard by Association Connecting Electronics Industries, 06/01/2016

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11/09/202015/08/2019

The 1999 Market for Electronics Manufacturing Services Providers/Contract Assembly Companies

Book by Association Connecting Electronics Industries, 04/07/2000

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11/09/202015/08/2019

IPC CHIPSCALE-99

Chip Scale and BGA National Symposium Proceedings 1999
Conference Proceeding by Association Connecting Electronics Industries, 05/01/1999

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11/09/202015/08/2019

IPC 4411-AM1

Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001

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11/09/202015/08/2019

IPC J-STD-030A

Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014

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