IPC SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
standard by Association Connecting Electronics Industries, 03/01/1988
- Comments Off on IPC SM-780
- IPC
Component Packaging and Interconnecting with Emphasis on Surface Mounting
standard by Association Connecting Electronics Industries, 03/01/1988
Post Solder Aqueous Cleaning Handbook
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1996
Guidelines for Molded Interconnection Devices
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/1990
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014