Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
standard by International Electrotechnical Commission, 04/26/2007
Electroacoustics – Random-incidence and diffuse-field calibration of sound level meters
standard by International Electrotechnical Commission, 06/07/1994
Metal halide lamps
standard by International Electrotechnical Commission, 09/30/1992
Multicore and symmetrical pair/quad cables for digital communications – Part 2: Symmetrical pair/quad cables with transmission characteristics up to 100 MHz – Horizontal floor wiring – Sectional specification
standard by International Electrotechnical Commission, 04/27/2010
Multicore and symmetrical pair/quad cables for digital communications – Part 6-1: Symmetrical pair/quad cables with transmission characteristics up to 1 000 MHz – Work area wiring – Blank detail specification
standard by International Electrotechnical Commission, 10/14/2009
Bayonet lampholders
standard by International Electrotechnical Commission, 05/22/2017
Maritime navigation and radiocommunication equipment and systems – Digital interfaces – Part 401: Multiple talkers and multiple listeners – Ship systems interconnection – Application profile
standard by International Electrotechnical Commission, 11/27/2001
Industrial communication networks – Fieldbus specifications – Part 4-11: Data-link layer protocol specification – Type 11 elements
standard by International Electrotechnical Commission, 08/05/2010
Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
standard by International Electrotechnical Commission, 08/28/1998
Radiotherapy simulators – Functional performance characteristics
standard by International Electrotechnical Commission, 12/22/1993
