IEC 60127-3 Ed. 2.0 b:1988

Miniature fuses – Part 3: Sub-miniature fuse-links
standard by International Electrotechnical Commission, 12/19/1988

IEC 60286-3 Ed. 3.0 b:1997

Packging of components for automatic handling – Part 3: Packaging of leadless components on continuous tapes
standard by International Electrotechnical Commission, 12/22/1997

IEC 60115-5-101 Ed. 1.0 b:1995

Fixed resistors for use in electronic equipment – Part 5: Detail specification: Fixed precision wirewound resistors with solderable axial wire leads – Stability class 0,1% – Assessment level E
standard by International Electrotechnical Commission, 02/10/1995

IEC 60092-506 Ed. 2.0 en:2003

Electrical installations in ships – Part 506: Special features – Ships carrying specific dangerous goods and materials hazardous only in bulk
standard by International Electrotechnical Commission, 06/26/2003

IEC 60191-2X Ed. 1.0 b CORR1:2000

Corrigendum 1 – Mechanical standardization of semiconductor devices – Part 2: Dimensions
Corrigenda by International Electrotechnical Commission, 01/31/2000

IEC 60317-39 Amd.1 Ed. 1.0 b:1997

Amendment 1 – Specifications for particular types of winding wires – Part 39: Glass-fibre braided resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 180
Amendment by International Electrotechnical Commission, 11/18/1997

IEC 60269-4 Amd.1 Ed. 3.0 b:1995

Amendment 1 – Low-voltage fuses. Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
Amendment by International Electrotechnical Commission, 12/13/1995

IEC 60227-1 Ed. 3.0 b:2007

Polyvinyl chloride insulated cables of rated voltages up to and including 450/750 V – Part 1: General requirements
standard by International Electrotechnical Commission, 10/10/2007

IEC 60127-6 Amd.2 Ed. 1.0 b:2002

Amendment 2 – Miniature fuses – Part 6: Fuse-holders for miniature cartridge fuse-links
Amendment by International Electrotechnical Commission, 12/19/2002

IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
standard by International Electrotechnical Commission, 04/23/1997