IEC 60151-6 Ed. 1.0 b:1965

Measurements of the electrical properties of electronic tubes and valves. Part 6: Methods of application of mechanical shock (impulse) excitation to electronic tubes and valves
standard by International Electrotechnical Commission, 01/01/1965

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IEC 60079-17 Ed. 3.0 b:2002

Electrical apparatus for explosive gas atmospheres – Part 17: Inspection and maintenance of electrical installations in hazardous areas (other than mines)
standard by International Electrotechnical Commission, 07/08/2002

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IEC 60050-212 Ed. 2.0 b:2010

International Electrotechnical Vocabulary (IEV) – Part 212: Electrical insulating solids, liquids and gases
standard by International Electrotechnical Commission, 06/29/2010

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IEC 60127-7 Ed. 1.0 b:2013

Miniature fuses – Part 7: Miniature fuse-links for special applications
standard by International Electrotechnical Commission, 03/20/2013

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IEC 60107-4 Ed. 1.1 b:1999

Recommended methods of measurement on receivers for television broadcast transmissions – Part 4: Electrical measurements on multichannel sound television receivers using the two-carrier FM-system CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 06/04/1999

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IEC 60050-351 Ed. 2.0 b:1998

International Electrotechnical Vocabulary – Part 351: Automatic control
standard by International Electrotechnical Commission, 09/30/1998

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IEC 60317-0-5 Amd.2 Ed. 1.0 b:1999

Amendment 2 – Specifications for particular types of winding wires – Part 0: General requirements – Section 5: Glass-fibre braided, bare or enamelled rectangular copper wire
Amendment by International Electrotechnical Commission, 10/20/1999

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IEC 60191-6 Ed. 2.0 en:2004

Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
standard by International Electrotechnical Commission, 09/29/2004

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IEC 60335-2-28 Ed. 4.0 b:2002

Household and similar electrical appliances – Safety – Part 2-28: Particular requirements for sewing machines
standard by International Electrotechnical Commission, 10/31/2002

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IEC 60191-6-8 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)
standard by International Electrotechnical Commission, 08/27/2001

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