IEC 60189-1 Amd.3 Ed. 2.0 b:1992

Amendment 3 – Low-frequency cables and wires with PVC insulation and PVC sheath. Part 1: General test and measuring methods
Amendment by International Electrotechnical Commission, 04/15/1992

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IEC 60064 Amd.3 Ed. 6.0 b:2005

Amendment 3 – Tungsten filament lamps for domestic and similar general lighting purposes – Performance requirements
Amendment by International Electrotechnical Commission, 03/17/2005

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IEC 60050-561 Ed. 1.0 t:1991

International Electrotechnical Vocabulary – Chapter 561: Piezoelectric devices for frequency control and selection
standard by International Electrotechnical Commission, 11/15/1991

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IEC 60096-3 Ed. 1.0 b:1982

Radio-frequency cables. Part 3: General requirements and tests for single-unit coaxial cables for use in cabled distribution systems
standard by International Electrotechnical Commission, 01/01/1982

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IEC 60095-4 Amd.1 Ed. 1.0 b:1996

Amendment 1 – Lead-acid starter batteries. Part 4: Dimensions of batteries for heavy trucks
Amendment by International Electrotechnical Commission, 02/07/1996

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IEC 60317-43 Amd.1 Ed. 1.0 b:2010

Amendment 1 – Specifications for particular types of winding wires – Part 43: Aromatic polyimide tape wrapped round copper wire, class 240
Amendment by International Electrotechnical Commission, 03/10/2010

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IEC 60269-2 Amd.2 Ed. 2.0 b:2001

Amendment 2 – Low-voltage fuses. Part 2: Supplementary requirements for fuses for use by authorized persons (fuses mainly for industrial application)
Amendment by International Electrotechnical Commission, 11/22/2001

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IEC 60245-3 Amd.2 Ed. 2.0 b:2011

Amendment 2 – Rubber insulated cables – Rated voltages up to and including 450/750 V – Part 3: Heat resistant silicone insulated cables
Amendment by International Electrotechnical Commission, 09/23/2011

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IEC 60254-2 Ed. 3.1 b:2000

Lead-acid traction batteries – Part 2: Dimensions of cells and terminals and marking of polarity on cells CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/15/2000

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IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)
standard by International Electrotechnical Commission, 01/07/2010

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