IEC 60335-2-24 Amd.1 Ed. 6.0 b:2005

Amendment 1 – Household and similar electrical appliances – Safety – Part 2-24: Particular requirements for refrigerating appliances, ice-cream appliances and ice-makers
Amendment by International Electrotechnical Commission, 02/09/2005

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IEC 60332-3-25 Amd.1 Ed. 1.0 b:2008

Amendment 1 – Tests on electric and optical fibre cables under fire conditions – Part 3-25: Test for vertical flame spread of vertically-mounted bunched wires or cables – Category D
Amendment by International Electrotechnical Commission, 12/12/2008

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IEC 60061-4 Amd.9 Ed. 1.0 b:2004

Amendment 9 – Lamp caps and holders together with gauges for the control of interchangeability and safety – Part 4: Guidelines and general information
Amendment by International Electrotechnical Commission, 11/25/2004

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IEC 62963 Ed. 1.0 b:2020

Radiation protection instrumentation – X-ray computed tomography (CT) inspection systems of bottled/canned liquids
standard by International Electrotechnical Commission, 06/11/2020

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IEC 60317-0-6 Ed. 1.1 b:2007

Specifications for particular types of winding wires – Part 0-6: General requirements – Glass-fibre wound resin or varnish impregnated, bare or enamelled round copper wire CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 01/18/2007

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IEC 60264-2-3 Ed. 1.0 b:1990

Packaging of winding wires. Part 2: Cylindrical barrelled delivery spools. Section Three: Specification for non-returnable spools made from thermoplastic material
standard by International Electrotechnical Commission, 08/15/1990

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IEC 60050-702 Ed. 1.0 b:1992

International Electrotechnical Vocabulary – Chapter 702: Oscillations, signals and related devices
standard by International Electrotechnical Commission, 05/31/1992

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IEC 60255-12 Ed. 1.0 b:1980

Electrical relays – Part 12: Directional relays and power relays with two input energizing quantities
standard by International Electrotechnical Commission, 01/01/1980

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IEC 60191-6-10 Ed. 1.0 en:2003

Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Dimensions of P-VSON
standard by International Electrotechnical Commission, 11/19/2003

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IEC 60191-2 Amd.3 Ed. 1.0 b:2001

Amendment 3 – Mechanical standardization of semiconductor devices – Part 2: Dimensions
Amendment by International Electrotechnical Commission, 08/28/2001

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