IEC 60067 Ed. 2.0 b:1966

Dimensions of electronic tubes and valves
standard by International Electrotechnical Commission, 01/01/1966

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IEC 60300-3-9 Ed. 1.0 b:1995

Dependability management – Part 3: Application guide – Section 9: Risk analysis of technological systems
standard by International Electrotechnical Commission, 12/18/1995

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IEC 60255-181 Ed. 1.0 b:2019

Measuring relays and protection equipment – Part 181: Functional requirements for frequency protection
standard by International Electrotechnical Commission, 02/27/2019

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IEC 60068-2-20 Ed. 5.0 b:2008

Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads
standard by International Electrotechnical Commission, 07/21/2008

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IEC 61108-5 Ed. 1.0 b:2020

Maritime navigation and radiocommunication equipment and systems – Global navigation satellite systems (GNSS) – Part 5: BeiDou navigation satellite system (BDS) – Receiver equipment – Performance requirements, methods of testing and required test results
standard by International Electrotechnical Commission, 03/11/2020

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IEC 60286-3-2 Ed. 1.0 en:2009

Packaging of components for automatic handling – Part 3-2: Packaging of surface mount components on continuous tapes – Type VI – Blister carrier tapes of 4 mm width
standard by International Electrotechnical Commission, 05/13/2009

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IEC 60335-2-16 Amd.2 Ed. 5.0 b:2011

Amendment 2 – Household and similar electrical appliances – Safety – Part 2-16: Particular requirements for food waste disposers
Amendment by International Electrotechnical Commission, 09/13/2011

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IEC 60092-203 Ed. 1.0 b:1985

Electrical installations in ships. Part 203: System design – Acoustic and optical signals
standard by International Electrotechnical Commission, 12/30/1985

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IEC 60068-2-10 Amd.1 Ed. 6.0 b:2018

Amendment 1 – Environmental testing – Part 2-10: Tests – Test J and guidance: Mould growth
Amendment by International Electrotechnical Commission, 04/25/2018

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IEC 60191-2 Amd.5 Ed. 1.0 b:2002

Amendment 5 – Mechanical standardization of semiconductor devices. Part 2: Dimensions
Amendment by International Electrotechnical Commission, 02/12/2002

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