IEC 60191-6-2 Ed. 1.0 b:2001
Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
standard by International Electrotechnical Commission, 12/11/2001
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