IEC 60050-601 Ed. 1.0 t:1985

International Electrotechnical Vocabulary (IEV) – Part 601: Generation, transmission and distribution of electricity – General
standard by International Electrotechnical Commission, 10/30/1985

IEC 62906-5-6 Ed. 1.0 en:2020

Laser displays – Part 5-6: Measuring methods for optical performance of projection screens
standard by International Electrotechnical Commission, 04/28/2020

IEC 60900 Cor.2 Ed. 4.0 b:2020

Corrigendum 2 – Live working – Hand tools for use up to 1 000 V AC and 1 500 V DC
Corrigenda by International Electrotechnical Commission, 05/14/2020

IEC 60286-3 Ed. 5.0 b:2013

Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes
standard by International Electrotechnical Commission, 05/17/2013

IEC 60146-1-1 Ed. 3.0 b:1991

Semiconductor convertors – General requirements and line commutated convertors – Part 1-1: Specifications of basic requirements
standard by International Electrotechnical Commission, 04/15/1991

IEC 60034-14 Ed. 3.0 b:2003

Rotating electrical machines – Part 14: Mechanical vibration of certain machines with shaft heights 56 mm and higher – Measurement, evaluation and limits of vibration severity
standard by International Electrotechnical Commission, 11/26/2003

IEC 60086-6 Ed. 1.0 b:2020

Primary batteries – Part 6: Guidance on environmental aspects
standard by International Electrotechnical Commission, 02/07/2020

IEC 60214-1 Ed. 2.0 b:2014

Tap-changers – Part 1: Performance requirements and test methods
standard by International Electrotechnical Commission, 05/22/2014

IEC 60191-6-20 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ)
standard by International Electrotechnical Commission, 08/30/2010

IEC 60191-6-10 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Dimensions of P-VSON
standard by International Electrotechnical Commission, 11/19/2003