Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
standard by International Electrotechnical Commission, 06/27/2007
Amendment 2 – Environmental testing – Part 2: Tests. Tests B: Dry heat
Amendment by International Electrotechnical Commission, 05/31/1994
Amendment 1 – Semiconductor convertors – General requirements and line commutated convertors – Part 1-1: Specifications of basic requirements
Amendment by International Electrotechnical Commission, 07/12/1996
Dimensions and output series for rotating electrical machines – Part 1: Frame numbers 56 to 400 and flange numbers 55 to 1080
standard by International Electrotechnical Commission, 02/01/1991
Amendment 9 – International Electrotechnical Vocabulary (IEV) – Part 161: Electromagnetic compatibility
Amendment by International Electrotechnical Commission, 10/17/2019
Low-voltage fuses – Part 2: Supplementary requirements for fuses for use by authorized persons (fuses mainly for industrial application) – Examples of standardized systems of fuses A to K
standard by International Electrotechnical Commission, 07/11/2013
Rotating electrical machines – Part 8: Terminal markings and direction of rotation
standard by International Electrotechnical Commission, 06/22/2007
Programmable controllers – ALL PARTS
standard by International Electrotechnical Commission, 01/06/2020
OPC unified architecture – Part 7: Profiles
standard by International Electrotechnical Commission, 06/22/2020
Connectors for frequencies below 3 MHz – Part 5: Rectangular multipole connectors with blade contacts
standard by International Electrotechnical Commission, 01/01/1966
