IEC 60068-3-4 Ed. 1.0 b:2001
Environmental testing – Part 3-4: Supporting documentation and guidance – Damp heat tests
standard by International Electrotechnical Commission, 08/28/2001
- Comments Off on IEC 60068-3-4 Ed. 1.0 b:2001
- IEC
Environmental testing – Part 3-4: Supporting documentation and guidance – Damp heat tests
standard by International Electrotechnical Commission, 08/28/2001
Amendment 2 – International Electrotechnical Vocabulary (IEV) – Part 705: Radio wave propagation
Amendment by International Electrotechnical Commission, 12/16/2016
Radio-frequency connectors. Part 17: R.F. coaxial connectors with inner diameter of outer conductor 6.5 mm (0.256 in) with screw coupling – Characteristic impedance 50 ohms (Type TNC)
standard by International Electrotechnical Commission, 01/01/1980
Rating systems for electronic tubes and valves and analogous semiconductor devices
standard by International Electrotechnical Commission, 01/01/1961
Amendment 12 – Mechanical standardization of semiconductor devices – Part 2: Dimensions
Amendment by International Electrotechnical Commission, 03/24/2006
Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
standard by International Electrotechnical Commission, 06/27/2007
Amendment 2 – Environmental testing – Part 2: Tests. Tests B: Dry heat
Amendment by International Electrotechnical Commission, 05/31/1994
Amendment 1 – Semiconductor convertors – General requirements and line commutated convertors – Part 1-1: Specifications of basic requirements
Amendment by International Electrotechnical Commission, 07/12/1996
Dimensions and output series for rotating electrical machines – Part 1: Frame numbers 56 to 400 and flange numbers 55 to 1080
standard by International Electrotechnical Commission, 02/01/1991
Amendment 9 – International Electrotechnical Vocabulary (IEV) – Part 161: Electromagnetic compatibility
Amendment by International Electrotechnical Commission, 10/17/2019